BZX84J series
Single Zener diodes
Rev. 01 — 1 March 2007
Product data sheet
1.Product profile
1.1General description
General-purpose Zener diodes in a SOD323F (SC-90) very small and flat leadSurface-Mounted Device (SMD) plastic package.
1.2Features
INon-repetitive peak reverse powerdissipation:≤40W
ITotal power dissipation:≤550mWITwo tolerance series:±2%and±5%
IWide working voltage range: nominal2.4Vto75V (E24range)ILow differential resistance
ISmall plastic package suitable forsurface-mounted design
1.3Applications
IGeneral regulation functions
1.4Quick reference data
Table 1.SymbolVFPZSM
[1][2]
Quick reference dataParameterforward voltagenon-repetitive peak reversepower dissipation
ConditionsIF=100mA[1][2]
Min--
Typ--
Max1.140
UnitVW
Pulse test: tp≤300µs;δ≤0.02.
tp=100µs; square wave; Tj=25°C prior to surge
2.Pinning information
Table 2.Pin12
Pinning
Descriptioncathodeanode
[1]Simplified outline12Symbol12
006aaa152[1]The marking bar indicates the cathode.
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BZX84J series
Single Zener diodes
3.Ordering information
Table 3.
Ordering information
PackageNameBZX84J-B2V4 toBZX84J-C75[1]
[1]
Type numberDescriptionplastic surface-mounted package; 2leadsVersionSOD323FSC-90The series consists of 74types with nominal working voltages from 2.4V to75V.
4.Marking
Table 4.
Marking codes
MarkingcodeSLSMSTSUSVSWSZTATDTETHTKTMTNTPS8S9SASBType numberBZX84J-B15BZX84J-B16BZX84J-B18BZX84J-B20BZX84J-B22BZX84J-B24BZX84J-B27BZX84J-B30BZX84J-B33BZX84J-B36BZX84J-B39BZX84J-B43BZX84J-B47BZX84J-B51BZX84J-B56BZX84J-B62BZX84J-B68BZX84J-B75-MarkingcodeSCSDSESFSGSHSKSNSPSRSSSXSYTBTCTFTGTL-Type numberBZX84J-C2V4BZX84J-C2V7BZX84J-C3V0BZX84J-C3V3BZX84J-C3V6BZX84J-C3V9BZX84J-C4V3BZX84J-C4V7BZX84J-C5V1BZX84J-C5V6BZX84J-C6V2BZX84J-C6V8BZX84J-C7V5BZX84J-C8V2BZX84J-C9V1BZX84J-C10BZX84J-C11BZX84J-C12BZX84J-C13MarkingcodeU3U4U9UAUBUCUFUGULUMURUSUUUVUWTRTSTTTUType numberBZX84J-C15BZX84J-C16BZX84J-C18BZX84J-C20BZX84J-C22BZX84J-C24BZX84J-C27BZX84J-C30BZX84J-C33BZX84J-C36BZX84J-C39BZX84J-C43BZX84J-C47BZX84J-C51BZX84J-C56BZX84J-C62BZX84J-C68BZX84J-C75-MarkingcodeTVTWTXTYTZU1U2U5U6U7U8UDUEUHUKUNUPUT-Type numberBZX84J-B2V4BZX84J-B2V7BZX84J-B3V0BZX84J-B3V3BZX84J-B3V6BZX84J-B3V9BZX84J-B4V3BZX84J-B4V7BZX84J-B5V1BZX84J-B5V6BZX84J-B6V2BZX84J-B6V8BZX84J-B7V5BZX84J-B8V2BZX84J-B9V1BZX84J-B10BZX84J-B11BZX84J-B12BZX84J-B13BZX84J_SER_1© NXP B.V. 2007. All rights reserved.
Product data sheetRev. 01 — 1 March 20072 of 12
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BZX84J series
Single Zener diodes
5.Limiting values
Table 5.Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).SymbolIFIZSM
Parameterforward currentnon-repetitive peak reversecurrent
non-repetitive peak reversepower dissipationtotal power dissipationjunction temperatureambient temperaturestorage temperature
tp=100µs; square wave; Tj=25°C prior to surge
Device mounted on an FR4Printed-Circuit Board (PCB), single-sided copper, tin-plated, mounting pad forcathode 1cm2.
[1]
ConditionsMin--
Max250seeTable8and940550150+150+150
UnitmAPZSMPtotTjTambTstg
[1][2]
[1]---−65−65
WmW°C°C°C
Tamb≤25°C
[2]
6.Thermal characteristics
Table 6.SymbolRth(j-a)Rth(j-sp)
[1][2]
Thermal characteristicsParameterthermal resistance fromjunction to ambientthermal resistance fromjunction to solder point
Conditionsin free air[1]Min--
Typ--
Max23055
UnitK/WK/W
[2]
Device mounted on an FR4PCB, single-sided copper, tin-plated, mounting pad for cathode 1cm2.Soldering point of cathode tab.
7.Characteristics
Table 7.Characteristics
Tj=25°C unless otherwise specified.SymbolVF
Parameterforward voltage
IF=10mAIF=100mA
[1]
Pulse test: tp≤300µs;δ≤0.02.
Conditions[1]Min--
Typ--
Max0.91.1
UnitVV
BZX84J_SER_1© NXP B.V. 2007. All rights reserved.
Product data sheetRev. 01 — 1 March 20073 of 12
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BZX84J series
Single Zener diodes
Table 8.Characteristics per type; BZX84J-B2V4 to BZX84J-C24Tj=25°C unless otherwise specified.BZX84JSel-xxxWorkingvoltageVZ(V)IZ=5mAMin2V42V73V03V33V63V94V34V75V15V66V26V87V58V29V1101112
BCBCBCBCBCBCBCBCBCBCBCBCBCBCBCBCBCBC
BZX84J_SER_1
Differentialresistancerdif(Ω)IZ=1mAIZ=5mAMax400450500500500500600500480400150808080100150150150
Max10010095959090908060401015101010101010
ReversecurrentIR(µA)TemperaturecoefficientSZ(mV/K)IZ=5mADiodeNon-repetitivecapacitancepeak reversecurrentC(pF)[1]dIZSM(A)[2]Max12121212121212121212121244332.52.5
Max2.452.62.752.93.063.23.373.53.673.83.984.14.394.64.7955.25.45.7166.326.66.947.27.657.98.368.79.289.610.210.611.211.612.212.7
Max50201055333213210.70.50.20.10.1
VR(V)Min111111122244556788
−3.5−3.5−3.5−3.5−3.5−3.5−3.5−3.5−2.7−20.41.22.53.23.84.55.46
Max00000000.21.22.53.74.55.36.278910
Max450440425410390370350325300275250215170150120110108105
2.352.22.652.52.942.83.233.13.533.43.823.74.2144.614.454.85.495.26.085.86.666.47.3578.047.78.928.59.89.410.810.411.811.4
© NXP B.V. 2007. All rights reserved.
Product data sheetRev. 01 — 1 March 20074 of 12
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BZX84J series
Single Zener diodes
Table 8.Characteristics per type; BZX84J-B2V4 to BZX84J-C24 …continuedTj=25°C unless otherwise specified.BZX84JSel-xxxWorkingvoltageVZ(V)IZ=5mAMin13151618202224
BCBCBCBCBCBCBC
[1][2]
Differentialresistancerdif(Ω)IZ=1mAIZ=5mAMax170200200225225250250
Max10152020202530
ReversecurrentIR(µA)TemperaturecoefficientSZ(mV/K)IZ=5mADiodeNon-repetitivecapacitancepeak reversecurrentC(pF)[1]dIZSM(A)[2]Max2.521.51.51.51.251.25
Max13.314.115.315.616.317.118.419.120.421.222.423.324.525.6
Max0.10.050.050.050.050.050.05
VR(V)Min810.511.212.61415.416.8
79.210.412.414.416.418.4
Max11131416182022
Max103999793888480
12.712.414.713.815.715.317.616.819.618.821.620.823.522.8
f=1MHz; VR=0V
tp=100µs; square wave; Tj=25°C prior to surge
BZX84J_SER_1© NXP B.V. 2007. All rights reserved.
Product data sheetRev. 01 — 1 March 20075 of 12
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BZX84J series
Single Zener diodes
Table 9.Characteristics per type; BZX84J-B27 to BZX84J-C75Tj=25°C unless otherwise specified.BZX84J-SelxxxWorkingvoltageVZ(V)IZ=2mAMin273033363943475156626875
BCBCBCBCBCBCBCBCBCBCBCBC
[1][2]
Differentialresistancerdif(Ω)IZ=0.5mAIZ=2mAMax250250275300300325325350375400400400
Max40404060758090110120140160175
ReversecurrentIR(µA)TemperaturecoefficientSZ(mV/K)IZ=2mADiodeNon-repetitivecapacitancepeak reversecurrentC(pF)[1]dIZSM(A)[2]Max110.90.80.70.60.50.40.30.30.250.2
Max27.528.930.63233.73536.73839.84143.94647.950525457.16063.26669.47276.579
Max0.050.050.050.050.050.050.050.050.050.050.050.05
VR(V)Min18.92123.125.227.330.132.935.739.243.447.652.5
21.424.427.430.433.437.64246.652.258.865.673.4
Max25.329.433.437.441.246.651.857.263.871.679.888.6
Max736660595856555249444035
26.525.129.42832.33135.33438.23742.14046.144504854.95260.85866.66473.570
f=1MHz; VR=0V
tp=100µs; square wave; Tj=25°C prior to surge
BZX84J_SER_1© NXP B.V. 2007. All rights reserved.
Product data sheetRev. 01 — 1 March 20076 of 12
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BZX84J series
Single Zener diodes
103PZSM(W)mbg801300IF(mA)200mbg781102(1)10(2)100110−11tp (ms)1000.60.8VF (V)1(1)Tj=25°C (prior to surge)(2)Tj=150°C (prior to surge)Tj=25°CFig 1.Non-repetitive peak reverse power dissipationas a function of pulse duration; maximumvalues0.5SZ(mV/K)04V7mld444Fig 2.Forward current as a function of forwardvoltage; typical values12SZ(mV/K)815mld4454V3−0.52V42V7−13V94131211109V18V27V56V86V25V65V13V6−1.53V33V00−210−1110IZ (mA)102−410−1110IZ (mA)102BZX84J-B/C2V4 to BZX84J-B/C4V7Tj=25°Cto150°CBZX84J-B/C5V1 to BZX84J-B/C15Tj=25°Cto150°CFig 3.Temperature coefficient as a function ofworking current; typical valuesFig 4.Temperature coefficient as a function ofworking current; typical valuesBZX84J_SER_1© NXP B.V. 2007. All rights reserved.
Product data sheetRev. 01 — 1 March 20077 of 12
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BZX84J series
Single Zener diodes
50IZ(mA)40006aaa996VZ(nom) (V) = 2.73.33.94.75.66.88.2VZ(nom) (V) = 10IZ(mA)251230006aaa9972030152010101852227333615002468VZ (V)1000102030VZ (V)40Tj=25°CBZX84J-B/C2V7 to BZX84J-B/C8V2All curves have a test current IZ=5mA.Tj=25°CBZX84J-B/C10 to BZX84J-B/C36For the curves VZ(nom)=(10, 12, 15, 18, 22)V thetest current IZ=5mA.For the curves VZ(nom)=(27, 33, 36)V the testcurrent IZ=2mA.Fig 5.Working current as a function of workingvoltage; typical valuesFig 6.Working current as a function of workingvoltage; typical valuesBZX84J_SER_1© NXP B.V. 2007. All rights reserved.
Product data sheetRev. 01 — 1 March 20078 of 12
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8.Package outline
1.351.1510.50.30.800.652.72.31.81.620.400.25Dimensions in mm0.250.1004-09-13Fig 7.Package outline SOD323F(SC-90)9.Packing information
Table 10.Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]Type numberPackageDescription4mm pitch, 8mm tape and reelPacking quantity3000BZX84J-B2V4toSOD323FBZX84J-C75
[1]
10000-135-115For further information and the availability of packing methods, seeSection13.
10.Soldering
3.052.802.101.60solder landssolder resist1.650.950.500.60occupied areasolder paste0.50(2×)msa433Reflow soldering is the only recommended soldering method.Dimensions in mmFig 8.Reflow soldering footprint SOD323F(SC-90)BZX84J_SER_1© NXP B.V. 2007. All rights reserved.
Product data sheetRev. 01 — 1 March 20079 of 12
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11.Revision history
Table 11.
Revision history
Release date20070301
Data sheet statusProduct data sheet
Change notice-Supersedes-Document IDBZX84J_SER_1
BZX84J_SER_1© NXP B.V. 2007. All rights reserved.
Product data sheetRev. 01 — 1 March 200710 of 12
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Single Zener diodes
12.Legal information
12.1Data sheet status
Document status[1][2]Objective [short] data sheetPreliminary [short] data sheetProduct [short] data sheet
[1][2][3]
Product status[3]DevelopmentQualificationProduction
DefinitionThis document contains data from the objective specification for product development.This document contains data from the preliminary specification.This document contains the product specification.
Please consult the most recently issued document before initiating or completing a design.The term ‘short data sheet’ is explained in section “Definitions”.
Theproductstatusofdevice(s)describedinthisdocumentmayhavechangedsincethisdocumentwaspublishedandmaydifferincaseofmultipledevices.Thelatestproductstatusinformation is available on the Internet at URLhttp://www.nxp.com.
12.2Definitions
Draft —The document is a draft version only. The content is still underinternal review and subject to formal approval, which may result inmodifications or additions. NXP Semiconductors does not give anyrepresentations or warranties as to the accuracy or completeness of
informationincludedhereinandshallhavenoliabilityfortheconsequencesofuse of such information.
Short data sheet —A short data sheet is an extract from a full data sheetwiththesameproducttypenumber(s)andtitle.Ashortdatasheetisintendedforquickreferenceonlyandshouldnotbereliedupontocontaindetailedandfull information. For detailed and full information see the relevant full datasheet, which is available on request via the local NXP Semiconductors salesoffice. In case of any inconsistency or conflict with the short data sheet, thefull data sheet shall prevail.
malfunctionofaNXPSemiconductorsproductcanreasonablybeexpectedtoresult in personal injury, death or severe property or environmental damage.NXP Semiconductors accepts no liability for inclusion and/or use of NXPSemiconductors products in such equipment or applications and thereforesuch inclusion and/or use is at the customer’s own risk.
Applications —Applications that are described herein for any of theseproducts are for illustrative purposes only. NXP Semiconductors makes norepresentation or warranty that such applications will be suitable for thespecified use without further testing or modification.
Limiting values —Stress above one or more limiting values (as defined intheAbsoluteMaximumRatingsSystemofIEC60134)maycausepermanentdamagetothedevice.Limitingvaluesarestressratingsonlyandoperationofthe device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limitingvalues for extended periods may affect device reliability.
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12.3Disclaimers
General —Information in this document is believed to be accurate and
reliable.However,NXPSemiconductorsdoesnotgiveanyrepresentationsorwarranties,expressedorimplied,astotheaccuracyorcompletenessofsuchinformation and shall have no liability for the consequences of use of suchinformation.
Right to make changes —NXPSemiconductorsreservestherighttomakechanges to information published in this document, including without
limitation specifications and product descriptions, at any time and withoutnotice.Thisdocumentsupersedesandreplacesallinformationsuppliedpriorto the publication hereof.
Suitability for use —NXP Semiconductors products are not designed,authorized or warranted to be suitable for use in medical, military, aircraft,space or life support equipment, nor in applications where failure or
12.4Trademarks
Notice:Allreferencedbrands,productnames,servicenamesandtrademarksare the property of their respective owners.
13.Contact information
For additional information, please visit:http://www.nxp.com
For sales office addresses, send an email to:salesaddresses@nxp.com
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14.Contents
1Product profile. . . . . . . . . . . . . . . . . . . . . . . . . . 11.1General description. . . . . . . . . . . . . . . . . . . . . . 11.2Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11.3Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 11.4Quick reference data. . . . . . . . . . . . . . . . . . . . . 12Pinning information. . . . . . . . . . . . . . . . . . . . . . 13Ordering information. . . . . . . . . . . . . . . . . . . . . 24Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 36Thermal characteristics. . . . . . . . . . . . . . . . . . . 37Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 38Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 99Packing information. . . . . . . . . . . . . . . . . . . . . . 910Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 911Revision history. . . . . . . . . . . . . . . . . . . . . . . . 1012Legal information. . . . . . . . . . . . . . . . . . . . . . . 1112.1Data sheet status . . . . . . . . . . . . . . . . . . . . . . 1112.2Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 1112.3Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 1112.4Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 1113Contact information. . . . . . . . . . . . . . . . . . . . . 1114
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
BZX84J series
Single Zener diodes
Pleasebeawarethatimportantnoticesconcerningthisdocumentandtheproduct(s)described herein, have been included in section ‘Legal information’.
© NXP B.V.2007.All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 1 March 2007
Document identifier: BZX84J_SER_1
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