专利名称：Circuit structure with multifunction circuit
cover
发明人：Edward B. Stoneham,Thomas M. Gaudette申请号：US11692129申请日：20070327公开号：US07813145B2公开日：20101012
专利附图：
摘要：A cover assembly may be mounted on a substrate. The cover assembly mayhave an interior surface spaced from the substrate and may bound a hollow chamberover a circuit assembly. The hollow chamber may be filled with a fluid, such as a gas or a
liquid. The cover assembly may also have an edge extending along the substrate aroundthe circuit assembly and may include a dielectric cover, an electromagnetic shield, aconductive assembly, a resistive layer, and an aperture with a gas-permeable membrane.The electromagnetic shield. The dielectric cover may substantially enclose the hollowchamber bounded by the cover assembly. The electromagnetic shield may be attachedto the dielectric cover and also substantially enclose the hollow chamber. The conductiveassembly may extend along and may be electrically isolated from the electromagneticshield. The conductive assembly may be conductively coupled to the circuit assembly.
申请人：Edward B. Stoneham,Thomas M. Gaudette
地址：Los Altos CA US,Cameron Park CA US
国籍：US,US
代理机构：Kolisch Hartwell, P.C.
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