专利名称:PRINTED CIRCUIT BOARD, ANTENNA,
WIRELESS COMMUNICATION DEVICE ANDMANUFACTURING METHODS THEREOF
发明人:HAMADA, Hiroki,TAMAOKA, Hiroyuki,ISO,
Yoichi
申请号:EP11789939.3申请日:20110603公开号:EP2579695A1公开日:20130410
专利附图:
摘要:Low-loss printed circuit boards, low-loss wide-band antennas, and
manufacturing methods thereof are provided by using a resin as a boardmaterial.
Aresinmaterial (101) having a predetermined shape is prepared in a molding step, and theresin material (101) is foamed in a foaming step. As a result, a skin layer (111) and afoamed part (112) are formed. Since the skin layer (111) does not allow close contact ofplating, the skin layer (111) is removed in the shape of a conductor pattern in a skin-layerremoving step to expose the foamed part (112) in the interior. Electroless plating iscarried out in a conductor-layer forming step; and, as a result, plating is brought intoclose contact with the foamed part (112) having an anchor effect, and a conductor layer(120) is formed.
申请人:Furukawa Electric Co., Ltd.
地址:2-3, Marunouchi 2-chome Chiyoda-ku Tokyo 100-8322 JP
国籍:JP
代理机构:advotec.
更多信息请下载全文后查看
因篇幅问题不能全部显示,请点此查看更多更全内容