专利名称：METHOD FOR MANUFACTURING PACKAGE
STRUCTURE OF OPTICAL DEVICE
发明人：Kuo-Chung Yee申请号：US12471455申请日：20090525
公开号：US20090239329A1公开日：20090924
专利附图：
摘要：A package structure of optical devices has a chip, a sealant, a cover, a substrate,a plurality of bonding wires, and a transparent encapsulant. The chip has at least anoptical device and a plurality of chip connection pads. The sealant is disposed around the
optical elements. The cover is disposed on the sealant. The substrate supports the chipand has a plurality of connection pads. The bonding wires are used for electricallyconnecting the chip connection pads of the chip to the connection pads of the substrate.The transparent encapsulant is formed over the substrate and the cover, andencapsulates the bonding wires.
申请人：Kuo-Chung Yee
地址：Taipei TW
国籍：TW
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