专利名称：Stepped Package For Image Sensor发明人：Vage Oganesian申请号：US14665084申请日：20150323
公开号：US20150200219A1公开日：20150716
专利附图：
摘要：An image sensor package includes a crystalline handler having opposing firstand second surfaces, and a cavity formed into the first surface. At least one step extendsfrom a sidewall of the cavity, wherein the cavity terminates in an aperture at the secondsurface. A cover is mounted to the second surface and extends over and covers the
aperture. The cover is optically transparent to at least one range of light wavelengths. Asensor chip is disposed in the cavity and mounted to the at least one step. The sensorchip includes a substrate with front and back opposing surfaces, a plurality of photodetectors formed at the front surface, and a plurality of contact pads formed at thefront surface which are electrically coupled to the photo detectors.
申请人：Optiz, Inc.
地址：Palo Alto CA US
国籍：US
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