ZXMS6002GTA;中文规格书,Datasheet资料

2024-02-03 来源：钮旅网

ZXMS6002G

60V N-Channel self protected enhancement mode IntelliFET™ MOSFET with status indication

Summary

Continuous drain source voltageOn-state resistance

Nominal load current (VIN = 5V)Clamping energy

VDS = 60V500m⍀ 1.4A550mJ

Description

Self protected low side MOSFET. Monolithicover temperature, over current, over voltage(active clamp) and ESD protected logic levelfunctionality. Intended as a general purposeswitch, with status indication.

Features

•••••••••

Status pin (analog status indication)Short circuit protection with auto restartOver voltage protection (active clamp)Thermal shutdown with auto restartOver-current protectionInput protection (ESD)

Load dump protection (actively protectsload)

Logic level input

High continuous current rating

Note: The tab is connected to the drain pin andmust be electrically isolated from the sourcepin. Connection of significant copper to the tabis recommended for best thermal performance.

SDStatusINTop viewOrdering information

Device

ZXMS6002GTA

Part markZXMS6002

Reel size(inches)

Tape width(mm)12 embossed

Quantityper reel1000

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ZXMS6002G

Functional block diagram

StatusD Over voltage protection IN Over current protection Logic Over temperature protection dV/dt limitation Human body ESD protection SApplications and information

••••••

Especially suited for loads with a high in-rush current such as lamps and motorsAll types of resistive, inductive and capacitive loads in switching applications␮C compatible power switch for 12V and 24V DC applicationsAutomotive rated

Replaces electromechanical relays and discrete circuits

Linear mode capability - the current-limiting protection circuitry is designed to de-activate at

low VDS, in order not to compromise the load current during normal operation. The designmax. DC operating current is therefore determined by the thermal capability of the package/board combination, rather than by the protection circuitry

Note: This does not compromise the product's ability to self-protect during short-circuit loadconditions.

Status pin voltage reflects the gate drive being applied internally to the power MOSFET.With VIN = 5V:

Status voltage ~ 5V indicates normal operation.

Status voltage ~ (2-3)V indicates that the device is in current-limiting mode.Status voltage < 1V indicates that the device is in thermal shutdown.

•

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Absolute maximum ratings

Parameter

Continuous drain-source voltage

Drain-source voltage for short circuit protection VIN=5VDrain-source voltage for short circuit protection VIN=10V

Continuous input voltagePeak input voltage

Operating temperature rangeStorage temperature rangePower dissipation @ Tamb =25°C(a)

Continuous drain current @ VIN=10V; Tamb=25°C(a)Continuous drain current @ VIN=5V; Tamb=25°C(a)Continuous source current (body diode)(a)Pulsed source current (body diode)(b)Unclamped single pulse inductive energyLoad dump protection

Electrostatic discharge (human body model)DIN humidity category, DIN 40 040IEC climatic category, DIN IEC 68-1

SymbolVDSVDS(SC)VDS(SC)VINVINTj,TstgPDIDIDISISEASVLoadDump

VESD

Limit603620-0.2 ... +10-0.2 ... +20-40 to +150-55 to +150

2.51.61.434.7550804000E40/150/56

UnitVVVVV°C°CWAAAAmJVV

Thermal resistance

Parameter

Junction to ambient(a)Junction to ambient(b)

SymbolR⍜JAR⍜JA

Limit5028

Unit°C/W°C/W

NOTES:

(a)For a device surface mounted on 50mm x 50mm x 1.6mm FR4 board with a high coverage of single sided 2oz weightcopper.

(b)For a device surface mounted on FR4 board as (a) and measured at t<=10s.

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Characteristics

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Electrical characteristics (at Tamb = 25°C unless otherwise stated)

Parameter

Static characteristicsDrain-source clamp voltageOff state drain currentOff state drain currentInput threshold voltage (*) Input currentInput currentInput current

Static drain-source on-state resistance

Static drain-source on-state resistanceCurrent limit (†) Current limit(†)

Dynamic characteristicsTurn-off time (VIN to 90% ID)

toff

1383.2

202010

␮sV/␮sV/␮s

RL=22⍀, VIN=10V to 0V, VDD=12VRL=22⍀, VIN=0 to 10V, VDD=12VRL=22⍀, VIN=10V to 0V, VDD=12V

VDS(AZ)IDSSIDSSVIN(th)IINIINIINRDS(on)RDS(on)ID(LIM)ID(LIM)

0.71.0160

700.132.10.71.545203851.01.8

1.22.776755001.52.375315

V␮A␮AVmAmAmAm⍀m⍀AA

ID=10mAVDS=12V, VIN=0VVDS=32V, VIN=0VVDS=VGS, ID=1mAVIN=+5VVIN=+7VVIN=+10VVIN=5V, ID=0.7AVIN=10V, ID=0.7AVIN=5V, VDS>5VVIN=10V, VDS>5V

Symbol

Min.

Typ.

Max.

Unit

Conditions

Slew rate on (70 to 50% VDD)-dVDS/dtonSlew rate off (50 to 70% VDD)DVDS/dtonProtection functions (‡) Required input voltage for over temperature protectionThermal overload trip temperatureThermal hysteresis

EASUnclamped single pulse

inductive energy Tj=25°C

EASUnclamped single pulse

inductive energy Tj=150°C

550

VPROTTJT

4.5150

1751

°C°CmJ

ID(ISO)=0.7A, VDD=32VID(ISO)=0.7A, VDD=32V

200mJ

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ZXMS6002G

Electrical characteristics (at Tamb = 25°C unless otherwise stated)

ParameterStatus flagNormal operationCurrent limit operatingThermal shutdown activatedNormal operationCurrent limit operationThermal shutdown activatedInverse diodeSource drain voltage

VSD

VIN=0V, -ID=1.4A,

VSTATUSVSTATUSVSTATUSVSTATUSVSTATUSVSTATUS

4.952.50.28.03.00.35

VVVVVV

VIN = 5VVIN = 5VVIN = 5VVIN = 10VVIN = 10VVIN = 10V

Symbol

Min.

Typ.

Max.

Unit

Conditions

NOTES:

(*)Protection features may operate outside spec for VIN<4.5V.

(†)The drain current is limited to a reduced value when Vds exceeds a safe level

(‡)Integrated protection functions are designed to prevent IC destruction under fault conditions described in thedatasheet. Fault conditions are considered as \"outside\" normal operating range. Protection functions are not designedfor continuous, repetitive operation.

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Typical characteristics

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Package outline - SOT223

DIMAA1bb2CD

MillimetersMin-0.020.662.900.236.30

Max1.800.100.843.100.336.70

InchesMin0.00080.0260.1140.0090.248

Max0.0710.0040.0330.1220.0130.264

DIMee1EE1L-

MillimetersMin

Max

2.30 BSC4.60 BSC6.703.300.90-7.303.70--

InchesMin

Max

0.0905 BSC0.181 BSC0.2640.1300.355-0.2870.146--

Note: Controlling dimensions are in millimeters. Approximate dimensions are provided in inches

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Definitions

Product change

Zetex Semiconductors reserves the right to alter, without notice, specifications, design, price or conditions of supply of any product orservice. Customers are solely responsible for obtaining the latest relevant information before placing orders.Applications disclaimer

The circuits in this design/application note are offered as design ideas. It is the responsibility of the user to ensure that the circuit is fit forthe user’s application and meets with the user’s requirements. No representation or warranty is given and no liability whatsoever isassumed by Zetex with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rightsarising from such use or otherwise. Zetex does not assume any legal responsibility or will not be held legally liable (whether in contract,tort (including negligence), breach of statutory duty, restriction or otherwise) for any damages, loss of profit, business, contract,opportunity or consequential loss in the use of these circuit applications, under any circumstances.Life support

Zetex products are specifically not authorized for use as critical components in life support devices or systems without the express writtenapproval of the Chief Executive Officer of Zetex Semiconductors plc. As used herein:A. Life support devices or systems are devices or systems which:

1.are intended to implant into the body or

2.support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in thelabelling can be reasonably expected to result in significant injury to the user.

B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to

cause the failure of the life support device or to affect its safety or effectiveness.Reproduction

The product specifications contained in this publication are issued to provide outline information only which (unless agreed by thecompany in writing) may not be used, applied or reproduced for any purpose or form part of any order or contract or be regarded as arepresentation relating to the products or services concerned. Terms and Conditions

All products are sold subjects to Zetex’ terms and conditions of sale, and this disclaimer (save in the event of a conflict between the twowhen the terms of the contract shall prevail) according to region, supplied at the time of order acknowledgement.For the latest information on technology, delivery terms and conditions and prices, please contact your nearest Zetex sales office.Quality of product

Zetex is an ISO 9001 and TS16949 certified semiconductor manufacturer.

To ensure quality of service and products we strongly advise the purchase of parts directly from Zetex Semiconductors or one of ourregionally authorized distributors. For a complete listing of authorized distributors please visit: www.zetex.com/salesnetwork

Zetex Semiconductors does not warrant or accept any liability whatsoever in respect of any parts purchased through unauthorized sales channels.ESD (Electrostatic discharge)

Semiconductor devices are susceptible to damage by ESD. Suitable precautions should be taken when handling and transporting devices.The possible damage to devices depends on the circumstances of the handling and transporting, and the nature of the device. The extentof damage can vary from immediate functional or parametric malfunction to degradation of function or performance in use over time.Devices suspected of being affected should be replaced.Green compliance

Zetex Semiconductors is committed to environmental excellence in all aspects of its operations which includes meeting or exceedingregulatory requirements with respect to the use of hazardous substances. Numerous successful programs have been implemented toreduce the use of hazardous substances and/or emissions.

All Zetex components are compliant with the RoHS directive, and through this it is supporting its customers in their compliance withWEEE and ELV directives.Product status key:“Preview”Future device intended for production at some point. Samples may be available“Active”Product status recommended for new designs“Last time buy (LTB)”Device will be discontinued and last time buy period and delivery is in effect“Not recommended for new designs”Device is still in production to support existing designs and production“Obsolete”Production has been discontinuedDatasheet status key:“Draft version”This term denotes a very early datasheet version and contains highly provisional information, which

may change in any manner without notice.

“Provisional version”This term denotes a pre-release datasheet. It provides a clear indication of anticipated performance.

However, changes to the test conditions and specifications may occur, at any time and without notice.

“Issue”This term denotes an issued datasheet containing finalized specifications. However, changes to

specifications may occur, at any time and without notice.Zetex sales officesEurope

Zetex GmbH

Kustermann-parkBalanstraße 59D-81541 MünchenGermany

Telefon: (49) 89 45 49 49 0Fax: (49) 89 45 49 49 49europe.sales@zetex.com

Americas

Zetex Inc

700 Veterans Memorial HighwayHauppauge, NY 11788USA

Telephone: (1) 631 360 2222Fax: (1) 631 360 8222usa.sales@zetex.com

Asia Pacific

Zetex (Asia Ltd)

3701-04 Metroplaza Tower 1Hing Fong Road, Kwai FongHong Kong

Telephone: (852) 26100 611Fax: (852) 24250 494asia.sales@zetex.com

Corporate Headquarters

Zetex Semiconductors plc

Zetex Technology Park, ChaddertonOldham, OL9 9LLUnited Kingdom

Telephone: (44) 161 622 4444Fax: (44) 161 622 4446hq@zetex.com

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ZXMS6002GTA;中文规格书,Datasheet资料