SMART CARD AND METHOD FOR MANUFACTURING SAME

专利名称：SMART CARD AND METHOD FOR

MANUFACTURING SAME

发明人：Zhou LU,Huazhang Yu申请号：US15577399申请日：20160608

公开号：US20180174008A1公开日：20180621

专利附图：

摘要：Provided is a method for manufacturing a smart card, comprising: mounting asecure chip () on a modular circuit board () to obtain a secure chip module, one layer ofthe modular circuit board () being provided with a plurality of contact points () insulated

from each other; planting a solder ball () on the secure chip solder pad () of the maincircuit board (); according to the position of the secure chip solder pad () on the maincircuit board (), milling out a groove () on the substrate on which the main circuit board ()is packed, such that the solder ball () on the secure chip solder pad () is visible at thebottom of the groove (); packing the secure chip module into the groove (), and by meansof the solder ball () on the secure chip solder pad (), mounting the secure chip moduleonto the main circuit board (). The method reduces the restrictions to the wiring of themain circuit board caused by the contact points on the surface of the smart card, thusimproving the quality of the wiring of the main circuit board; furthermore, electroniccircuit-level expansion may be performed on the contact point module and the securechip, increasing the scalability of the smart card.

申请人：Feitian Technologies Co., Ltd.

地址：Beijing CN

国籍：CN

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